Semiconductor Packaging
Overview and Significance
Semiconductor packaging has long been a key part of semiconductor devices, as it refers to the protective physical enclosure with interconnects, powers, and protected chips. It is among the most important primary drivers of innovation and economic growth. The nation’s expanding demand in areas like industrial automation, healthcare, automobiles, and artificial intelligence drives the need for integrated advanced packaging solutions. In addition to meeting these application needs, strengthening semiconductor packaging design capabilities domestically generates high-value talent and research and development opportunities.
Recent progressions in high-speed and high-power systems have led to the development of electronic and thermal systems involved in semiconductor packaging. The advancement of semiconductor packaging is of great importance to the semiconductor ecosystem in India. Since there has historically been a shortage of talent in package design and semiconductor packaging, developing this skill set is crucial. India can create a pool of talented package designers, encourage innovation in semiconductor packaging, and lessen dependency on foreign intellectual property by funding advanced semiconductor packaging research and training. To sum up, building advanced semiconductor packaging design skills will nurture India’s semiconductor independence, fostering domestic innovation in industrial, commercial, and household applications to cater modern environment in the future.
Success Stories
To learn more about the interesting work and success stories in the field of AMS/RF across India, visit our Success Stories page. Link
Technical Committee members
Dr. Pradeep Dixit
Associate Professor IIT Bombay |
Dr. Pradeep Associate Professor, IIT Bombay. He is a distinguished educator and a leading expert in the fields of electrochemical discharge machining and MEMS process integration. His extensive expertise includes hermetic encapsulation techniques for MEMS sensors, advanced MEMS packaging solutions, and the development of through-silicon vias (TSVs) for high-performance 3D interconnects. Additionally, he specializes in deep reactive ion etching (DRIE) and copper electrodeposition processes.
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Dr. Anandaroop Bhattacharya
Professor IIT Kharagpur |
Dr. Anandaroop is Professor at IIT Kharagpur. A professor of Mechanical Engineering whose pioneering work is advanced electronic packaging and cooling, transport phenomena in porous media, and battery thermal management. His work spans a broad spectrum of heat transfer and fluid mechanics, seamlessly integrating fundamental science with cutting-edge practical applications along with thermal challenges in modern electronic systems.
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Dr. Prosenjit Sen
Associate Professor IISc Bangalore |
Dr. Prosenjit is an Associate Professor at IISc Bangalore. He is a distinguished professor renowned for his extensive expertise in interfacial microfluidics, particularly for lab-on-chip technologies. His research spans the development of nanostructures for self-cleaning and antimicrobial surfaces, innovative use of interfaces to study cells in cytometry and circulating tumor cell (CTC) separation, as well as 3D heterogeneous integration of micro- and nanoscale devices aimed at advancing system scaling.
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Dr. Nilesh Badwe
Assistant Professor IIT Kanpur |
Dr. Nilesh Badwe is an Assistant Professor at IIT Kanpur. A renowned expert in the development of novel metals and alloys for advanced applications. He excels at unraveling failure mechanisms through intricate structure-property correlations. His expertise spans advanced material design, including alloy development, microstructure engineering, sophisticated coatings, and efficient manufacturing processes. He seamlessly integrates fundamental insights with practical solutions to drive technological excellence.
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Dr. Subu Iyer
Professor UCLA |
Dr. Subu Iyer is Professor and Charles P. Reames Endowed Chair at UCLA. He possesses unparalleled expertise in system scaling technologies, with a particular focus on advanced packaging and 3D integration. His deep knowledge encompasses cutting-edge techniques for memory subsystem integration, enabling enhanced performance and efficiency in complex electronic systems. Additionally, he is a recognized authority in neuromorphic computing, pioneering innovative approaches that bridge hardware design with brain-inspired architectures.
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Dr. Veeresh Deshpande
Associate Professor IIT Bombay |
Dr. Veeresh Deshpande is an Associate Professor at IIT Bombay. He is an esteemed expert specializing in semiconductor technology research and development. His proficiency includes 3D integration, neuromorphic computing, ferroelectric and resistive memory devices, and advanced semiconductor packaging. His current work focuses on next-generation computing technologies, advanced chiplet packaging and quantum computing system development.
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